Excessive-Velocity Excessive-Precision Metrology


ST. FLORIAN, Austria, November 15, 2021EV Group (EVG), a number one provider of wafer bonding and lithography tools for the MEMS, nanotechnology and semiconductor markets, at the moment unveiled the EVG®40 NT2 automated metrology system, which offers overlay and important dimension (CD) measurements for wafer-to-wafer (W2W), die-to-wafer (D2W) and die-to-die (D2D) bonding in addition to maskless lithography purposes.

​​​​The EVG®40 NT2 automated metrology system from EV Group offers overlay and CD measurements for wafer-to-wafer, die-to-wafer and die-to-die bonding in addition to maskless lithography purposes.​​​​​​​

Designed for high-volume manufacturing with suggestions loops for real-time course of correction and optimization, the EVG40 NT2 helps gadget producers, foundries and packaging homes speed up the introduction of latest 3D/heterogeneous integration merchandise in addition to enhance yields and keep away from scrapping of extremely precious wafers.

EVG will showcase the EVG40 NT2 system for the primary time on the SEMICON Europa tradeshow, happening November 16-19 on the Messe München in Munich, Germany. Attendees all for studying extra can go to EVG in Corridor B1, sales space B1460.

Heterogeneous Integration Roadmap Driving New Metrology Wants

As conventional 2D silicon scaling reaches its value limits, the semiconductor trade is popping to heterogeneous integration—the manufacturing, meeting and packaging of a number of completely different parts or dies with completely different characteristic sizes and supplies onto a single gadget or package deal—as a way to enhance efficiency on new gadget generations. In W2W, D2W and D2D bonding, tight alignment and overlay accuracy is required to attain good electrical contact between the interconnected gadgets. As interconnect pitches turn out to be tighter with every new product technology, wafer and die bond alignment and overlay processes should additionally scale accordingly, with better accuracy and extra frequent measurements to determine course of issues once they happen as a way to present corrective motion or the chance for rework, resulting in greater manufacturing yields. Maskless publicity, an progressive lithographic method for 3D/heterogeneous integration, requires more and more exact sample constancy and sample overlay on extremely warped and distorted wafers that usually incorporate shifted dies—driving the necessity for metrology that delivers essential data on die place.

“Course of management is more and more essential for modern 3D and heterogeneous integration purposes,” acknowledged Dr. Thomas Glinsner, company know-how director at EV Group. “The EVG40 NT2 represents a serious breakthrough in metrology efficiency to fulfill the brand new calls for for the superior packaging trade. It offers not solely better overlay accuracy but additionally a major increase in throughput to allow greater measurement density per wafer, giving extra detailed suggestions on hybrid bonding efficiency, for instance. This new metrology answer rounds out EVG’s complete portfolio of course of options for 3D/heterogeneous integration, and enhances our present EVG40 NT system, which stays the de facto bond metrology customary for MEMS and sophisticated photonic gadgets. The EVG40 NT2 is already enjoying a key position in a number of joint growth initiatives underway at EVG’s Heterogeneous Integration Competence Middle™.”

Excessive-Precision, Excessive-Throughput Metrology Efficiency

The EVG40 NT2 system offers extremely exact measurements of essential bonding and lithography course of parameters for present and future modern 3D/heterogeneous integration purposes. These measurements embody: alignment verification and monitoring for W2W, D2W, D2D and maskless publicity processes; CD measurement; and multi-layer thickness measurement. It’s a extremely scalable system that options a number of measurement heads and a high-precision stage designed for high-throughput and high-accuracy (right down to the low single-digit nm vary) bonding and maskless publicity alignment verification. For alignment verification, the EVG40 NT2 generates an overlay mannequin that can be utilized in a suggestions loop for enhancing general alignment. This reduces systematic errors and leads to elevated manufacturing yields. The system is appropriate with a number of line optimization ideas for overlay suggestions and die place feed-forward required by next-generation fabs supporting Trade 4.0 manufacturing.

Product Availability

EVG is now accepting orders for the brand new EVG40 NT2 automated metrology system, and providing product demonstrations at EVG’s Heterogeneous Integration Competence Middle at its headquarters in Austria. For extra data, please go to https://www.evgroup.com/merchandise/metrology/

About EV Group (EVG)

EV Group (EVG) is a number one provider of kit and course of options for the manufacture of semiconductors, microelectromechanical techniques (MEMS), compound semiconductors, energy gadgets and nanotechnology gadgets. Key merchandise embody wafer bonding, thin-wafer processing, lithography/nanoimprint lithography (NIL) and metrology tools, in addition to photoresist coaters, cleaners and inspection techniques. Based in 1980, EV Group companies and helps an elaborate community of world clients and companions everywhere in the world. Extra details about EVG is on the market at www.EVGroup.com.